Film forming composition
Patent 5078791 Issued on January 7, 1992. Estimated Expiration Date: 
February 6, 2010. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.
February 6, 2010. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent References 2130560 2396667 3508933 3576779 3836371 3882128 Water washable petrolatum compositions Polish formulations Pressure sensitive adhesives Filling materials for communications cable InventorsAssigneeApplicationNo. 475777 filed on 02/06/1990US Classes:106/287.14, H or alkyl directly bonded to Si106/2, Coating repellent106/10, Wax, bituminous material or tarry residue containing106/271, With solvent or dispersing medium106/272, With filler, dye or pigment522/71, Processes of preparing or treating a solid polymer by wave energy in the presence of a designated nonreactant material (DNRM); or compositions therefore522/80, Carbon and hydrogen only containing DNRM522/172Processes of preparing a solid polymer from at least one silicon containing monomer; or compositions thereforeExaminersPrimary: Morris, TheodoreAssistant: Brusman, David M. Attorney, Agent or FirmInternational ClassesC09K 015/32C09D 004/00 AbstractA film forming composition including a film forming substance having amphiphilic molecules and being dispersed in a gel-like carrier having a non-liquid state below about 20° C. The carrier stabilizes the film forming substance, and inhibits diffusion of moisture and oxygen into the composition. This minimizes deterioration of the film forming substance, and also minimizes undesirable formation of agglomerations of such substance. When the composition is applied to a surface, an ultra thin substantially continuous film of substantially uniform thickness forms spontaneously and attaches to the surface. The excess composition is then washed away.Field of SearchWith filler, dye or pigment-OH bonded directly to Si atom H or alkyl directly bonded to Si With solvent or dispersing medium Si-O-C bonded compound Heavy metal compound containing O-containing organic compound Carbonyl group containing N containing Hydroxy group containing or alcoholate Halogen containing Organic halide Nitrogen containing Coating repellent Silicon containing other than solely as silicon dioxide or as part of an aluminum-containing compound Wax, bituminous material or tarry residue containing Processes of preparing or treating a solid polymer by wave energy in the presence of a designated nonreactant material (DNRM); or compositions therefore Carbon and hydrogen only containing DNRM Processes of preparing a solid polymer from at least one silicon containing monomer; or compositions therefore | |
