U.S. patents available from 1976 to present.
U.S. patent applications available from 2005 to present.

Apparatus for cleaning and rinsing wafers

Patent 5069235 Issued on December 3, 1991. Estimated Expiration Date: Icon_subject August 2, 2010. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.

Patent References

Apparatus for washing semiconductor wafers
Patent #: 4092176
Issued on: 05/30/1978
Inventor: Kozai, et al.

Submersible motor chemical processing apparatus
Patent #: 4325394
Issued on: 04/20/1982
Inventor: Reams

Apparatus for washing semiconductor materials
Patent #: 4361163
Issued on: 11/30/1982
Inventor: Aigo

Apparatus for liquid disinfecting and sterile rinsing
Patent #: 4601300
Issued on: 07/22/1986
Inventor: Sundheimer

Treatment basin for semiconductor material
Patent #: 4753258
Issued on: 06/28/1988
Inventor: Seiichiro

Cleaning apparatus
Patent #: 4934392
Issued on: 06/19/1990
Inventor: Henfrey

Constant bath system with weir Patent #: 4955402
Issued on: 09/11/1990
Inventor: Miranda

Inventors

Assignee

Application

No. 561778 filed on 08/02/1990

US Classes:

134/113, With alarm, signal, indicating, testing, inspecting, illuminating or display means134/182, With non-impelling fluid deflector or baffle other than conduits or nozzles134/186, With means to drain from and/or supply liquid to tank134/902SEMICONDUCTOR WAFER

Examiners

Primary: Coe, Philip R.

Attorney, Agent or Firm

Foreign Patent References

  • 782379 GB 09/13/2012

International Class

B08B 003/04

Abstract

Apparatus for cleaning and rinsing wafers is disclosed. The apparatus includes an inner tank contained within an outer tank. The inner tank has an open top forming a weir edge around the entire top of the tank. A bottom opening in the inner tank is covered by a dump door. The inner tank is contoured so that its cross-sectional area decreases in a direction toward the bottom of the tank. Sprayer manifolds are positioned slightly above the top edge of the inner tank to spray water into the inner tank. Wafers are positioned in the inner tank on a support plate. Manifolds below the support plate allow filling of the tank with water and nitrogen gas. The dump door is opened or closed by a pneumatic piston depending on whether the inner tank is being dumped or filled. A controller operates the apparatus to cycle through a predetermined program including dump, partial dump, cascade and spraying cycles. A monitoring system withdraws water from the outer tank and monitors the water for particular characteristics including resistivity, conductivity and redox potential.

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