U.S. patents available from 1976 to present.
U.S. patent applications available from 2005 to present.

Dense phase gas photochemical process for substrate treatment

Patent 5068040 Issued on November 26, 1991. Estimated Expiration Date: Icon_subject April 3, 2009. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.

Patent References

Oxidation of refractory organics in aqueous waste streams by hydrogen peroxide and ultraviolet light
Patent #: 4012321
Issued on: 03/15/1977
Inventor: Koubek

Apparatus for sanitizing liquids with ultra-violet radiation and ozone
Patent #: 4179616
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Inventor: Coviello ,   et al.

Process for renewing the adsorptive capacity of a bed of active carbon
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Issued on: 04/07/1981
Inventor: Connolly

Method and apparatus for treating water
Patent #: 4274970
Issued on: 06/23/1981
Inventor: Beitzel

Treatment of waste compositions
Patent #: 4289594
Issued on: 09/15/1981
Inventor: Alpaugh ,   et al.

Method of treating contaminated insoluble organic solid material
Patent #: 4437999
Issued on: 03/20/1984
Inventor: Mayne

Method and apparatus for the generation and utilization of ozone and singlet oxygen
Patent #: 4640782
Issued on: 02/03/1987
Inventor: Burleson

Method for pollution control in photographic processing
Patent #: 4735728
Issued on: 04/05/1988
Inventor: Wemhoff

Process for treatment of organic contaminants in solid or liquid phase wastes Patent #: 4793931
Issued on: 12/27/1988
Inventor: Stevens ,   et al.

Inventor

Application

No. 332124 filed on 04/03/1989

US Classes:

210/748, Utilizing electrical or wave energy (directly applied to liquid or material being treated)134/1, Including application of electrical radiant or wave energy to work134/31, Gas or vapor condensation or absorption oowork210/760Utilizing ozone

Examiners

Primary: Wyse, Thomas G.

Attorney, Agent or Firm

International Classes

C02F 001/32
C02F 001/78
B08B 003/12

Abstract

A process for removing undesired material from a chosen substrate by exposing the substrate simultaneously to ultraviolet radiation and a selected dense fluid, wherein the radiation produces a photochemical reaction that removes the undesired material from the substrate and the dense fluid enhances the removal of the undesired material. In an alternative embodiment, a reactive agent may additionally be used. The process may be used to remove contaminants from a substrate, etch a substrate surface, or destroy toxic organic material in industrial wastes.

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