ApplicationNo. 053142 filed on 05/21/1987
US Classes:29/835, And shaping, e.g., cutting or bending, etc.29/838, With deforming of lead or terminal29/845, With shaping or forcing terminal into base aperture257/E21.518Involving application of mechanical vibration, e.g., ultrasonic vibration (EPO)
ExaminersPrimary: Eley, Timothy V.
Attorney, Agent or Firm
Foreign Patent References
International ClassH05K 003/30
AbstractA method and apparatus for interconnecting electronic circuits using nearly pure soft annealed gold mechanically compressed within through-plated holes. The invention has its application in attaching integrated circuit dice directly to circuit boards by ball bonding gold wires to the bonding pads of the integrated circuit dice in a substantially perpendicular relationship to the surfaces of the dice and inserting the gold leads into through-plated holes of circuit boards which provide an electrical and a mechanical connection once the leads are compressed within the through-plated holes. The present invention also finds its application in the interconnection of sandwiched circuit board assemblies where soft gold lead wires are inserted into axially aligned through-plated holes of the circuit boards and compressed so that the hold lead wires compress and buckle within the through-plated holes, forming an electrical connection between the circuit boards.
Field of SearchMultilead component
By inserting component lead or terminal into base aperture
With deforming of lead or terminal
By deforming or shaping
With shaping or forcing terminal into base aperture
By metal fusion bonding
Including metal fusion
And shaping, e.g., cutting or bending, etc.
Contact secured to panel circuit by deformation
Panel circuit adapted to move along panel plane relative to coupling part for insertion of male contact
Secured by permanently bending, deforming, or crimping metallic part
Adapted to be secured by permanently bending or deforming metallic part