Multi-layer semiconductor device
Patent 5051865 Issued on September 24, 1991. Estimated Expiration Date: 
March 11, 2011. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.
March 11, 2011. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent References 3243660 3704455 3705332 Cooling system for multiwafer high density circuit Stacked semiconductor device with sloping sides Interconnected multiple circuit module Electronic circuit interconnection system Circuit module with enhanced heat transfer and distribution Multichip thin film module Patent #: 4698662 InventorAssigneeApplicationNo. 667257 filed on 03/11/1991US Classes:361/718, For integrated circuit257/686, Stacked arrangement257/712, With provision for cooling the housing or its contents257/E23.101, Selection of materials, or shaping, to facilitate cooling or heating, e.g., heat sinks (EPO)257/E25.013, Stacked arrangements of devices (EPO)361/708Specific chemical compound or elementExaminersPrimary: Williams, Howard L.Attorney, Agent or FirmForeign Patent References
International ClassH01L 023/34Foreign Application Priority Data1985-06-17 JPAbstractA multi-layer semiconductor device which includes a stacked wafer body having a plurality of sets of two semiconductor wafers and a heat sink plate interposed therebetween. An end of the heat sink plate of each set of wafers is exposed at at least one of the side surfaces of the stacked wafer body.An intermediate connecting circuit is provided for connecting circuits in each of the sets of two semiconductors wafers, the intermediate connecting circuit is provided on at least one side surface other than the surface at which the ends of the heat sink plate are exposed.Other References
Field of SearchWith heat sink | |
