Patent References 3605015 Method for deep level transient spectroscopy scanning and apparatus for carrying out the method Noncontacting conductivity type determination and surface state spectroscopy of semiconductor materials Apparatus for measuring carrier lifetimes of a semiconductor wafer Microwave measuring and apparatus for contactless non-destructive testing of photosensitive materials Method and apparatus for analyzing semiconductor devices using charge-sensitive electron-beam-injected-carrier microscopy Method for the examination of electrically active impurities of semiconductor materials or structures and measuring arrangement for carrying out the method High speed semiconductor characterization technique Method for contactless evaluation of characteristics of semiconductor wafers and devices Patent #: 4949034 InventorsAssigneeApplicationNo. 612926 filed on 11/14/1990US Classes:324/752, Using light probe324/767, Diode374/4LEAK OR FLAW DETECTIONExaminersPrimary: Cuchlinski, William A. Jr.Assistant: Bennett, G. Bradley Attorney, Agent or FirmInternational ClassG01R 031/26Foreign Application Priority Data1990-08-09 JPAbstractA semiconductor specimen is held by a stage which is equipped with a heater (and a cooler) to change the temperature of the specimen in a predetermined range. Minority carriers are generated in the specimen by irradiating it with an energy beam such as a laser beam. A signal reflecting the recombination process of minority carriers is detected in a non-contact manner by a combination of microwave oscillator and a microwave detector through the microwave impedance coupling with the specimen. Decay curves are obtained at a plurality of temperatures in the predetermined range. A deep impurity level in the specimen is determined by performing an Arrhenius' plot on the basis of the plurality of signal decay curves and the corresponding specimen temperatures.Other References
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