U.S. patents available from 1976 to present.
U.S. patent applications available from 2005 to present.

Method and apparatus for driving an integrated-circuit output pad

Patent 5039874 Issued on August 13, 1991. Estimated Expiration Date: Icon_subject March 15, 2010. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.

Patent References

Output circuit having transistor monitor for matching output impedance to load impedance
Patent #: 4719369
Issued on: 01/12/1988
Inventor: Asano ,   et al.

CMOS output buffer having improved noise characteristics
Patent #: 4731553
Issued on: 03/15/1988
Inventor: Van Lehn ,   et al.

Full-level, fast CMOS output buffer
Patent #: 4825101
Issued on: 04/25/1989
Inventor: Walters, Jr.

Driver circuit providing load and time adaptive current
Patent #: 4829199
Issued on: 05/09/1989
Inventor: Prater

Output buffer having programmable drive current
Patent #: 4855623
Issued on: 08/08/1989
Inventor: Flaherty

Output buffer for reducing switching induced noise Patent #: 4961010
Issued on: 10/02/1990
Inventor: Davis

Inventor

Application

No. 494196 filed on 03/15/1990

US Classes:

327/109, Having semiconductive load326/112, Field-effect transistor (e.g., JFET, etc.)326/121, CMOS326/124, Bipolar transistor (e.g., RTL, DCTL, etc.)327/170Slope control of leading or trailing edge of rectangular (e.g., clock, etc.) or pulse waveform

Examiners

Primary: Miller, Stanley D.
Assistant: Wambach, Margaret Rose

International Classes

H03K 003/01
H03K 005/12
H03K 019/094

Abstract

A binarily programmable IC output pad driver includes a pair of FET drivers, one of which is always drivingly connected to the chip output pad. A second driver is selectively connected to the pad for driving the same in concert with the first driver in order to increase signal transition speed on the output pad. With both drivers driving, noise on the output pad increases and, if the particular application is effected by the increased noise level, signals applied to input pads on the chip disconnect the second driver to reduce pad noise.

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