Patent ReferencesProcess of preparing thermoset resin substrates to improve adherence of electrolessly plated metal deposits Patent #: 4110147 InventorsAssigneeApplicationNo. 255435 filed on 10/11/1988US Classes:428/213, Thickness (relative or absolute)428/457, Of metal428/458, Next to polyester, polyamide or polyimide (e.g., alkyd, glue, or nylon, etc.)442/378Preformed metallic film or foil or sheet (film or foil or sheet had structural integrity prior to association with the nonwoven fabric)ExaminersPrimary: Herbert, Thomas J. Jr.Attorney, Agent or FirmForeign Patent References
International ClassB32B 015/08Foreign Application Priority Data1987-10-14 NLAbstractLaminate displaying improved blunt notch behavior, so that it is suitable for use as a construction material in aviation and cosmonautics. It comprises an intermediate layer of synthetic material reinforced by continuous glass filaments having a modulus of elasticity of at least 80 GPa. The glass filaments contain at least 58-69% by weight of SiO2, 18-29% by weight of Al2 O3, and MgO. Preferably, they have a tenacity of at least 4 GPa, and an elongation at break of at least 4%. The synthetic material may be an amorphous thermoplastic resin having a Tg>140° C. such as, e.g., polarylates, poly(ether)sulfones, polyetherimides or poly-p-phenylene ethers, or a semi- or para-crystalline resin having a crystalline melting point>170° C., such as poly-phenylene sulfides, polyetherketones or liquid crystal polymers.Other References
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