Patent References 3794518 Screenable contact structure and method for semiconductor devices Method for activating metal particles Patent #: 4477296 InventorsAssigneeApplicationNo. 430227 filed on 11/01/1989US Classes:427/102, Nonuniform coating427/123, Metal coating427/126.2, Glass or ceramic base or coating427/191, Metal particles427/192, Aluminum, copper, or zinc particles427/193, Vitrifiable particles427/199, Silicon compound, metal, or metallic compound containing particles applied427/201, Plural particulate materials applied427/279, Vitreous coating427/376.3Metal-containing coating (e.g., cermet, etc.)ExaminersPrimary: Pianalto, BernardAttorney, Agent or FirmInternational ClassB05D 005/12AbstractFine copper and nickel powders are well mixed in a preselected ratio with bonding agents and carriers as appropriate. The composition then may be patterned upon a substrate by screen printing and subsequent firing in a nitrogen atmosphere to produce a low sheet resistance, low TCR electrical resistor. Various alloy powders, inert materials, and glass frits may be used depending upon the desired characteristics.Other References
Field of SearchMetal particlesNonuniform coating Aluminum, copper, or zinc particles Metal coating Glass or ceramic base or coating Vitrifiable particles Silicon compound, metal, or metallic compound containing particles applied Plural particulate materials applied Vitreous coating Metal-containing coating (e.g., cermet, etc.) | |