Semiconductor device package with dies mounted on both sides of the central pad of a metal frame
Patent 5034350 Issued on July 23, 1991. Estimated Expiration Date: 
March 14, 2010. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.
March 14, 2010. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent References 3597666 Method for manufacturing a plastic encapsulated semiconductor device and a lead frame therefor Silver-coated electric composite materials Method for manufacturing a plastic encapsulated semiconductor device and a lead frame therefor Patent #: 4637130 InventorAssigneeApplicationNo. 493466 filed on 03/14/1990US Classes:29/827, Beam lead frame or beam lead device257/E23.052, Assembly of semiconductor devices on lead frame (EPO)264/272.17, Semiconductor or barrier layer device (e.g., integrated circuit, transistor, etc.)438/107, Assembly of plural semiconductive substrates each possessing electrical device438/111Using strip lead frameExaminersPrimary: Chaudhuri, OlikAssistant: Griffis, Andrew Attorney, Agent or FirmForeign Patent References
International ClassH01L 021/60Foreign Application Priority Data1987-09-23 ITAbstractA semiconductor device in a plastic or ceramic package contains at least one silicon die on each side of a central die pad of a single metal frame, thus allowing a substantial space saving on the printed circuit assembly card.The bonding of the silicon dies and the soldering of the connecting wires are performed on both sides of the frame by emplying a special slotted clamp fixture inside which a strip of frames is clamped during these assembly operations and relative quality control operations. | |
