Integrated thermoelectric cooling
February 28, 2010. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent References Re27934 3429040 Radiation cooling devices and processes Thermoelectric system Method of making conduction-cooled circuit package Radiation cooling devices and processes Infrared cooler for restricted regions Infrared cooler for restricted regions Monolithic Peltier temperature controlled junction Charge coupled device temperature gradient and moisture regulator InventorsApplicationNo. 486467 filed on 02/28/1990US Classes:257/701, Insulating material257/712, With provision for cooling the housing or its contents257/930, THERMOELECTRIC (E.G., PELTIER EFFECT) COOLING257/E23.082Cooling arrangements using Peltier effect (EPO)ExaminersPrimary: Larkins, William D.Assistant: Russell, Daniel N. Attorney, Agent or FirmForeign Patent References
International ClassH01L 023/38AbstractA thermoelectrically cooled integrated circuit package including an insulative module which defines a cavity, a thermoelectric cooler within the cavity, and an integrated circuit chip connected to the thermoelectric cooler, thus providing an integrated circuit package in which the integrated circuit package itself dissipates thermal energy generated by the integrated circuit chip. | |
