U.S. patents available from 1976 to present.
U.S. patent applications available from 2005 to present.

Thermoelectric heat pump/power source device

Patent 5022928 Issued on June 11, 1991. Estimated Expiration Date: Icon_subject June 11, 2008. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.

Patent References

Thermoelectric assembly and thermoelectric couples and subcouples therefor
Patent #: 3943553
Issued on: 03/09/1976
Inventor: Elfving ,   et al.

Scanning radiometer apparatus
Patent #: 4166390
Issued on: 09/04/1979
Inventor: Benzinger

Thermoelectrical arrangement
Patent #: 4492809
Issued on: 01/08/1985
Inventor: Dahlberg

Solar powered automobile cooling system
Patent #: 4658597
Issued on: 04/21/1987
Inventor: Shum

Thermoelectric module optimized for low temperature difference Patent #: 4828627
Issued on: 05/09/1989
Inventor: Connery

Inventor

Application

No. 161756 filed on 05/09/1988

US Classes:

136/212, Plural hot or cold junctions arranged in a single plane136/206Solar energy type

Examiners

Primary: Nelson, Peter A.

International Class

H01L 035/28

Abstract

A thermoelectric heat pump or power source device is provided with P-type and N-type elements made of either thin films or thick films for use on flexible or nonflexible substrates. For flexible units the film type elements are formed on substrates of such flexible, electrically insulation material as, for example, MYLAR and TEFLON; while for inflexible units the elements are formed on substrates of such materials as, for example, Beryllia, Alumina, ceramics, or plastics. Further, the elements are patterned on the different substrates for particular usages. For example, radial element patterns used for cooling hot spots and ladder element patterns are used for cooling linear hot bodies. Ladder element patterns may also be used on flexible substrates to be folded to form corrugations having cold strips and hot strips on opposing sides to which sheets of suitable material can be attached to form panels, blankets, therapeutic devices or pipe covers for heating or cooling their contents as desired.

Other References

  • Vacuum Deposited TED's for Electric Device Chip Cooling, Harpster, Second Int'l Conf. on Thermoelectric Energy, Mar. 22-28, 1978, pp. 43-4
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