Semiconductor cooling device

Patent 5021924 Issued on June 4, 1991. Estimated Expiration Date:

September 14, 2009. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.

Abstract Claims Description Full Text

Patent References

3298195

3524497

3843910

Air cooling equipment for electronic systems
Patent #: 4158875
Issued on: 06/19/1979
Inventor: Tajima , et al.

Cooling arrangement for plug-in module assembly
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Inventor: Parmerlee , et al.

Integral electric module and assembly jet cooling system
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Inventor: Mayer

Apparatus for cooling integrated circuit chips
Patent #: 4485429
Issued on: 11/27/1984
Inventor: Mittal

Expansion/evaporation cooling system for microelectronic devices
Patent #: 4838041
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Inventors

Assignee

Hitachi, Ltd.

Application

No. 407159 filed on 09/14/1989

US Classes:

361/699, Liquid165/104.33, Cooling electrical device165/908, FLUID JETS257/E23.093, In combination with jet impingement (EPO)361/698, And liquid361/700Change of physical state

Examiners

Primary: Tolin, Gerald P.

Attorney, Agent or Firm

Antonelli, Terry, Stout & Kraus

International Class

H05K 007/20

Foreign Application Priority Data

1988-09-19 JP

Abstract

A multi-chip module or a like device having a sealed structure for being cooled with a liquid cooling medium, and in which the semiconductor integrated circuit chips or the chip carriers mounting the chips are individually cooled with the forced convection cooling using a cooling liquid. The cooling liquid injection ports are so arranged that the cooling liquid flows substantially in parallel with the back surfaces of the chips.