Flip-chip package for integrated circuits
Patent 5019673 Issued on May 28, 1991. Estimated Expiration Date: 
August 22, 2010. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.
August 22, 2010. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent References 3331912 3689804 Modular receptacle pin grid array Method of making an ultra high density pad array chip carrier Module and a substrate for the module Highly integrated circuit and method for the production thereof Patent #: 4975765 InventorsAssigneeApplicationNo. 570751 filed on 08/22/1990US Classes:257/778, Flip chip257/E21.511, Mounting on insulating member provided with metallic leads, e.g., flip-chip mounting, conductive die mounting (EPO)257/E23.021Bump or ball contacts (EPO)ExaminersPrimary: Picard, Leo P.Assistant: Ledynh, Bot L. Attorney, Agent or FirmInternational ClassesH01L 023/28H01L 039/02 AbstractA flip-chip package for integrated circuits is provided by over-molding an integrated circuit assembly which includes a flip-chip mounted to a very thin chip carrier. The flip-chip includes an array of bumped pads which fill an array of matching conductive through holes on the chip carrier and securely couple thereto. The chip carrier includes an array of bumped contacts on its back surface which correspond to the bumped pads of the flip-chip. The transfer over molding of the integrated circuit assembly provides a layer of epoxy around the exposed surfaces of the flip-chip providing an environmentally protected and removable integrated circuit package. | |
