U.S. patents available from 1976 to present.
U.S. patent applications available from 2005 to present.

Grinding tool

Patent 5011511 Issued on April 30, 1991. Estimated Expiration Date: Icon_subject July 26, 2009. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.

Patent References

Cleaning tape for magnetic head
Patent #: 4138229
Issued on: 02/06/1979
Inventor: Tadokoro ,   et al.

Process for the manufacture of abrasives
Patent #: 4298356
Issued on: 11/03/1981
Inventor: Teschner ,   et al.

Manufacturing of flexible abrasives
Patent #: 4317660
Issued on: 03/02/1982
Inventor: Kramis ,   et al.

Abrasive compacts
Patent #: 4666466
Issued on: 05/19/1987
Inventor: Wilson

Method for adhesion of grit to blade tips
Patent #: 4689242
Issued on: 08/25/1987
Inventor: Pike

Coated abrasive suitable for use as a lapping material
Patent #: 4773920
Issued on: 09/27/1988
Inventor: Chasman ,   et al.

Brazing of diamond
Patent #: 4776862
Issued on: 10/11/1988
Inventor: Wiand

Textured lapping plate and process for its manufacture
Patent #: 4821461
Issued on: 04/18/1989
Inventor: Holmstrand

Sawblade segments utilizing polycrystalline diamond grit Patent #: 4883500
Issued on: 11/28/1989
Inventor: Deakins, et al.

Inventor

Application

No. 385735 filed on 07/26/1989

US Classes:

51/295, IMPREGNATING OR COATING AN ABRASIVE TOOL51/293, MISCELLANEOUS51/309Metal or metal oxide

Examiners

Primary: Dixon, William R. Jr.
Assistant: Thompson, Willie J.

Attorney, Agent or Firm

International Class

B24B 001/00

Foreign Application Priority Data

1988-07-27 CH

Abstract

A material removing tool wherein a wheel-shaped, rod-like, tubular or otherwise configurated carrier supports pulverulent and/or granular particles of abrasive material which are joined to each other and/or to the carrier by active solder, such as an alloy or an eutectic of copper, silver, titanium and/or zirconium. The particles can be individually joined to the carrier or they can form a compact wherein the particles are held together by active solder. The compact can be joined to the carrier by active solder or by a standard solder, such as common solder or eutectic solder. That surface of the carrier which is joined with particles of abrasive material can be provided with recesses for portions of abrasive particles which are joined to the carrier by active solder.

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