Metallized article and process for metallizing a non-conductive article

Patent 5008157 Issued on April 16, 1991. Estimated Expiration Date:

November 22, 2009. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.

Abstract Claims Description Full Text

Patent References

3661538

Inventor

Paxos, Michael N.

Application

No. 440252 filed on 11/22/1989

US Classes:

428/612, Microscopic interfacial wave or roughness428/621, With additional, spatially distinct nonmetal component428/670, Platinum group metal-base component428/671, Cu-base component alternative to Ag-, Au-, or Ni-base component428/674, Cu-base component428/680Ni-base component

Examiners

Primary: Dean, Richard O.
Assistant: Wyszomierski, George

Attorney, Agent or Firm

Renner, Kenner, Greive, Bobak, Taylor & Weber

International Class

B32B 015/04

Abstract

A metallized article (10) having a non-conductive surface (11) and a plurality of depressions (12) in the surface (11). A first layer of metal (13) being mechanically bonded to the non-conductive surface (11), such that the mechanical bond is enhanced by the interaction of the first layer of metal (13) and the depressions (12). An intermediate layer of metal (14) bonded to the first layer (13). A finish layer of metal (15) being bonded to the intermediate layer (14). The finish layer (15) being a metal which readily accepts a high polish or shine. A process for metallizing such an article having a non-conductive surface including the steps of etching the surface of the article with fluoride containing salts and the depositing of a first layer of metal onto the etched surface. The process further including depositing an intermediate layer of metal in an electroless manner, and then depositing a finish layer of metal by electrolysis.