Patent ReferencesResin compositions Method and apparatus for transport and processing of substrate with developing agent Polyphenylene ether compositions containing polyfunctional compounds Blends of polyphenylene ethers with phosphorus-containing polymers Preparation of plastic extrudate containing an additive Patent #: 4877568 InventorsAssigneeApplicationNo. 347105 filed on 05/03/1989US Classes:264/211, Utilizing added agent (e.g., flux, plasticizer, dispersing agent, etc.)264/313, Utilizing a flexible, deformable, or destructable molding surface or material264/319, Applying heat or pressure524/275, Oxygen wax DNRM524/340, Aryl compound having only one aryl ring and having one or more OH groups directly attached to nuclear carbons of the aryl524/394, Oxygen atom or metal atom DNRM, e.g., metal stearate, etc.524/494, Material contains glass525/68, With solid polymer derived from at least one phenolic reactant wherein at least one of the reactants forming the solid polymer is saturated; or with SPFI wherein at least one of the necessary ingredients is a phenolic reactant or with a reaction product thereof; or with phenolic-containing SICP525/92B, Solid polymer derived from a lactam; from an amino carboxylic acid or derivative; from a polyamine and a polycarboxylic acid or derivative525/391, Mixed with ethylenically unsaturated reactant or polymer derived therefrom525/392, Unsaturated aromatic reactant or polymer thereof525/396, Mixed with 1,2-epoxy containing reactant or polymer therefrom, or wherein polymer contains at least one 1,2-epoxy group525/397, Mixed with carboxylic acid or derivative reactant or polymer derived therefrom525/905POLYPHENYLENE OXIDEExaminersPrimary: Ziegler, JacobAttorney, Agent or FirmInternational ClassesC08L 071/12D01F 001/02 AbstractThermoplastic compositions comprising polyphenylene ether resin and polyamide resin are disclosed. The compositions further include a compatibilizer component, and an additive combination which includes both a metal stearate and an amide compound.Field of SearchUtilizing added agent (e.g., flux, plasticizer, dispersing agent, etc.)Utilizing a flexible, deformable, or destructable molding surface or material Applying heat or pressure Oxygen wax DNRM Aryl compound having only one aryl ring and having one or more OH groups directly attached to nuclear carbons of the aryl Oxygen atom or metal atom DNRM, e.g., metal stearate, etc. Material contains glass With solid polymer derived from at least one phenolic reactant wherein at least one of the reactants forming the solid polymer is saturated; or with SPFI wherein at least one of the necessary ingredients is a phenolic reactant or with a reaction product thereof; or with phenolic-containing SICP Mixed with ethylenically unsaturated reactant or polymer derived therefrom Unsaturated aromatic reactant or polymer thereof Mixed with 1,2-epoxy containing reactant or polymer therefrom, or wherein polymer contains at least one 1,2-epoxy group Mixed with carboxylic acid or derivative reactant or polymer derived therefrom POLYPHENYLENE OXIDE | |