Plastic package with lead frame crossunder
Packaging system for multiple semiconductor devices
Package semiconductor chip Patent #: 4862245
ApplicationNo. 306398 filed on 02/06/1989
US Classes:257/788, With specified encapsulant257/677, Of specified material other than copper (e.g., Kovar (T.M.))257/792, Including polyimide257/E23.039, Chip-on-leads or leads-on-chip techniques, i.e., inner lead fingers being used as die pad (EPO)257/E23.04, Having bonding material between chip and die pad (EPO)257/E23.115, Against alpha rays (EPO)257/E23.126, Double encapsulation or coating and encapsulation (EPO)257/E23.13Coating being foil (EPO)
ExaminersPrimary: James, Andrew J.
Assistant: Nguyen, Viet Q.
Attorney, Agent or Firm
Foreign Patent References
International ClassesH01L 023/52
Foreign Application Priority Data1988-02-12 JP
AbstractA semiconductor device having a structure in which an insulating resin film or sheet is stuck on the principal surface of a semiconductor chip which is formed with circuits and in which the inner lead portions of a lead frame are arranged on the principal surface of the semiconductor chip through the insulating sheet, is provided in order that the semiconductor chip having the highest possible density of integration may be received placed in a standardized package. The present invention particularly features the shape of the lead frame, according to which the inner lead portions lying within a sealing member are substantially entirely arrayed over the semiconductor chip itself. The fore or front ends of the inner lead portions and the external terminals are located near the shorter lateral sides thereof on the semiconductor chip and the corresponding electrical connections therebetween are along the shorter sides of the semiconductor chip by pieces of bonding wire connecting respective front ends of inner lead portions with corresponding external terminals.