Lead based alloy for the bonding of aluminum parts to parts comprising an alloy of a heavy metal Patent #: 4231794
ApplicationNo. 417607 filed on 10/05/1989
US Classes:420/571, Antimony containing420/589Tin containing
ExaminersPrimary: Morris, Theodore
Assistant: Phipps, Margery S.
Attorney, Agent or Firm
Foreign Patent References
International ClassesC22C 011/06
AbstractSoft soldering compositions posessing equal or better melting, wetting and strength properties than conventional straight tin-lead solders but with a reduced tin content are disclosed. The compositions consist of 1-35 wt % tin, 5-30 wt % cadmium 0.05-2.5 wt % antimony, balance essentially lead with 5-30 wt % cadmium, and/or 1-15 wt % bismuth. The solder alloys are characterized by their improved properties concerning solidification temperature gap, spread percentage, wetting time and shear strength. Specific compositions are disclosed having the necessary properties to successfully replace the tradional tin-lead solders containing 30, 40 and 50 wt % tin. The high temperature performance of bonds made with these new alloys are better because of their reduced tendency of intermetallic compounds formation with the substrate due to their lower tin content. In addition their production costs are attractive, being lower than those of their conventional tin-lead counterparts, making them competitive on the market of mechanical or electric mass-soldering applications.