Etching apparatus
Patent 4968375 Issued on November 6, 1990. Estimated Expiration Date: 
November 8, 2009. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.
November 8, 2009. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent ReferencesApparatus for etching of oxide film on semiconductor wafer Method for etching semiconductor wafers on one side Patent #: 4350562 InventorsAssigneeApplicationNo. 433165 filed on 11/08/1989US Classes:156/345.23, With specified workpiece support134/32, With work or work parts movable during treatment134/198, With spray or jet supplying and/or applying means438/748Projection of etchant against a moving substrate or controlling the angle or pattern of projected etchantExaminersPrimary: Powell, William A.Attorney, Agent or FirmInternational ClassesH01L 021/306B44C 001/22 C03C 015/00 C03C 025/06 Foreign Application Priority Data1988-11-11 JPAbstractA semiconductor substrate etching apparatus is disclosed. In this apparatus, a semiconductor substrate is mounted on the upper surface of a first vacuum chuck, an etching solution is supplied to a groove of a roller of a semiconductor substrate end surface etching mechanism, which covers the end surface of the semiconductor substrate, and the first vacuum chuck and the roller are rotated in the opposite directions. The end surface of the semiconductor substrate is brought into contact with the etching solution. The etching solution is then transferred onto the end surface of the substrate, thus performing etching of the end surface.Field of SearchUsing sequentially applied treating agentsOne a neutralizer for another One an acid or an acid salt Including steam, gaseous agent or temperature feature With work or work parts movable during treatment With means to movably mount or movably support the work or work support With movably mounted spray or jet applying conduits or nozzles With spray or jet supplying and/or applying means | |
