Arrangement of a semiconductor device for use in a card
January 23, 2009. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent References 3597834 Method of assembling a hermetically sealed semiconductor unit Installation of a semiconductor chip on a glass substrate Flat package for integrated circuit devices Method of mounting a silicon pellet on a ceramic substrate Information card Method of mounting semiconductor chip for producing semiconductor device and a chip-supporting member used therein Method of manufacturing an identification card and an identification manufactured, for example, by this method Memory card manufacturing method and cards thus obtained Data card and method of manufacturing same InventorAssigneeApplicationNo. 299609 filed on 01/23/1989US Classes:257/679, Smart (e.g., credit) card package257/709, With specified insulator to isolate device from housing257/792, Including polyimide257/E21.505, Insulative mounting semiconductor device on support (EPO)257/E23.064, For flat cards, e.g., credit cards (EPO)257/E23.176For flat cards, e.g., credit cards (EPO)ExaminersPrimary: Nimmo, Morris H.Foreign Patent References
International ClassH01L 023/28Foreign Application Priority Data1986-02-06 JPAbstractA card like semiconductor device comprising a circuit board made of plastic resin and a semiconductor pellet mounted to the circuit board, wherein a metal layer is formed on one surface of the semiconductor pellet on which semiconductor circuit is not formed. The semiconductor pellet is secured to the circuit board by bonding the metal layer to the circuit board and is sealed with a high polymer material on the circuit board.Other References
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