Substrate transport and cooling apparatus and method for same
May 18, 2008. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent References 3566960 3818982 Gas encapsulated cooling module Fluid cooling systems for electronic systems Method and apparatus for thermally stabilizing workpieces Mask apparatus for fine-line lithography Method for conducting heat to or from an article being treated under vacuum Apparatus for mechanically clamping semiconductor wafer against pliable thermally conductive surface Apparatus for gas-assisted, solid-to-solid thermal transfer with a semiconductor wafer Method for gas-assisted, solid-to-solid thermal transfer with a semiconductor wafer InventorsAssigneeApplicationNo. 195707 filed on 05/18/1988US Classes:165/80.1, WITH RETAINER FOR REMOVABLE ARTICLE29/25.01, BARRIER LAYER OR SEMICONDUCTOR DEVICE MAKING118/69, Cooling118/724By means to heat or coolExaminersPrimary: Schwadron, Martin P.Assistant: Flanigan, Allen J. Attorney, Agent or FirmInternational ClassesF28F 013/02C23C 014/50 AbstractA loading station receives a substrate into a load-lock volume pressure isolated from a loading station chamber which is open to a processing chamber. The volume is evacuated and the substrate lowered into the loading chamber. A transport arm moves the substrate from the loading station to a substrate carrier of a cooling fixture within the processing chamber. The carrier is connected to a clamp which together move vertically downward to lower the wafer onto a substrate seat of the fixture. During substrate processing the fixture is tiltable and rotatable and provides substrate cooling by solid-to-solid conduction, forced convection and free convection.Solid-to-solid conduction is provided by the clamp. The substrate is pressed to the fixture by the cooling clamp having a circulating cooling fluid.Forced convection is provided by a gas flowing into the microscopic areas between the substrate and the fixture at a pressure high enough to cause bowing or lifting of the substrate and thus to create a gas region between the substrate and the fixture. An O-ring provides a seal under the pressure of the clamps near the periphery of the substrate to substantially seal the gas from entering the processing chamber. The gas flows into and through the gas region absorbing heat energy from the back surface of the substrate and flowing out of the region.Free convection is provided by heat transfer between the substrate and the substrate seat. The pressure in the gas region is high enough that the mean free path of the gas molecules is less then the distance between the substrate and the fixture. As a result gas molecules absorb energy from the substrate and intermix and transfer energy with other molecules. Some molecules collide with the substrate seat and transfer heat energy to the seat. After substrate treatment the gas is evacuated from behind the substrate prior to release of the clamps.Other References
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