U.S. patents available from 1976 to present.
U.S. patent applications available from 2005 to present.

High transmittance, low emissivity article and method of preparation

Patent 4948677 Issued on August 14, 1990. Estimated Expiration Date: Icon_subject August 14, 2007. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.

Patent References

Re27473

Electrically conductive transparent laminated window
Patent #: 4017661
Issued on: 04/12/1977
Inventor: Gillery

Sputter coating of glass with an oxide of a metal having an atomic number between 48 and 51 and mixtures thereof
Patent #: 4094763
Issued on: 06/13/1978
Inventor: Gillery, et al.

Sputtering technique for the deposition of indium oxide
Patent #: 4113599
Issued on: 09/12/1978
Inventor: Gillery

Sputtering process and apparatus
Patent #: 4166018
Issued on: 08/28/1979
Inventor: Chapin

Low resistance indium oxide coatings
Patent #: 4201649
Issued on: 05/06/1980
Inventor: Gillery

Heat-reflecting panel having neutral-color outer appearance
Patent #: 4327967
Issued on: 05/04/1982
Inventor: Groth

Transparent conductive films and methods of producing same
Patent #: 4349425
Issued on: 09/14/1982
Inventor: Miyake ,   et al.

Low emissivity coatings on transparent substrates Patent #: 4462883
Issued on: 07/31/1984
Inventor: Hart

Inventor

Assignee

Application

No. 841056 filed on 03/17/1986

US Classes:

428/623, Adjacent to each other204/192.15, Specified deposition material or use204/192.26, Optical or photoactive428/432, Next to metal or compound thereof428/469Next to metal salt or oxide

Examiners

Primary: Kaplan, G. L.

Attorney, Agent or Firm

Foreign Patent References

  • 1270586 GB 04/13/1972

International Classes

C23C 014/08
B32B 015/04
B32B 017/06

Abstract

A method for improving the adhesion between metal and metal oxide films and an improved multiple layer coated article comprising primer layers between metal and metal oxide films are disclosed. Copper containing layers are used as primer layers; for example, copper oxide. The several layers are prepared by sputtering.

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