Diamond compacts and process for making same
September 27, 2008. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent References 3574580 Polycrystalline diamond body Compact-grained diamond material Silicon carbide and silicon bonded polycrystalline diamond body and method of making it Process for preparing a polycrystalline diamond body Process for preparing a silicon-bonded polycrystalline diamond body Polycrystalline diamond body and process Polycrystalline diamond body/silicon carbide substrate composite Method of making diamond compacts for rock drilling Patent #: 4259090 InventorAssigneeApplicationNo. 250259 filed on 09/27/1988US Classes:51/308, Clay, silica, or silicate51/309Metal or metal oxideExaminersPrimary: Lieberman, PaulAssistant: Thompson, Willie J. Attorney, Agent or FirmInternational ClassB24D 003/02Foreign Application Priority Data1984-08-24 AUAbstractA diamond compact comprised of 60-95 volume percent of diamond crystals which have been plastically deformed so that they form a rigid framework structure in which contacts between the diamond crystals occur over surfaces arising from plastic deformation of the diamond crystals during formation of the compact under pressure and temperature conditions within the graphite stability field. The diamond framework structure is bonded together by interstitial refractory carbide phases or metallic phases comprised of metals not forming carbides in the presence of carbon. The phases have a melting point greater than 1600° C. The compact comprises less than about 2 percent volume of graphite and possesses a compressive strength greater than 10 kbars. | |
