Trimming element for microelectric circuit
Patent 4947020 Issued on August 7, 1990. Estimated Expiration Date: 
January 18, 2009. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.
January 18, 2009. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent ReferencesProduction of resistor from insulating material by local heating Method and apparatus for forming low resistance lateral links in a semiconductor device Laser make-link programming of semiconductor devices Method of forming conductor path Patent #: 4694138 InventorsApplicationNo. 298131 filed on 01/18/1989US Classes:219/121.65, Melting219/121.6, Using laser257/E23.147, Comprising antifuses, i.e., connections having their state changed from nonconductive to conductive (EPO)257/E23.148Change of state resulting from use of external beam, e.g., laser beam or ion beam (EPO)ExaminersPrimary: Albritton, C. L.Attorney, Agent or FirmInternational ClassB23K 076/00Foreign Application Priority Data1988-01-20 JPAbstractA trimming element comprises (a) a medium layer, (b) a pair of electrodes connected to the medium layer, and (c) an alloy layer, which is formed of metal of the electrodes and material of the medium layer and is created in the medium layer, for substantially short-circuiting the electrodes to each other. The alloy layer is obtained by applying a laser beam to the medium layer to heat a portion between the electrodes. The metal layer for substantially short-circuiting the electrodes is thus formed. | |
