Process for preparation of microspheres
Patent 4933105 Issued on June 12, 1990. Estimated Expiration Date: 
May 13, 2008. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.
May 13, 2008. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent ReferencesProcess for encapsulation of medicaments Processes for preparation of microspheres Process for preparation of microspheres Patent #: 4384975 InventorAssigneeApplicationNo. 193977 filed on 05/13/1988US Classes:424/462, Containing solid synthetic polymers264/4.6, Solid-walled microcapsule formed by physically removing a constituent (e.g., evaporation, extraction, etc.)264/12, By impinging or atomizing with gaseous jet or blast424/497, Containing solid synthetic polymers427/213.36, Solid-walled microcapsule formed from preformed synthetic polymer436/531, Carrier is synthetic resin514/951, POWDERS, GRANULES OR PARTICLES OF SPECIFIED MESH OR PARTICLE SIZE514/963, Microcapsule-sustained or differential release514/965Discrete particles in supporting matrixExaminersPrimary: Lovering, Richard D.Attorney, Agent or FirmForeign Patent References
International ClassB01J 013/00AbstractMicrospheres, prepared by solvent removal from an oil-in-water emulsion using carboxylic acid salt surfactant, e.g., sodium oleate as the emulsifier.Field of SearchSolid-walled microcapsule formed by physically removing a constituent (e.g., evaporation, extraction, etc.)By impinging or atomizing with gaseous jet or blast Solid-walled microcapsule formed from preformed synthetic polymer Containing solid synthetic polymers Containing solid synthetic polymers Removing material at reduced pressure, e.g., flashing, sublimation, spray drying, etc. |
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