Vinyl polymerization with boron chelates as catalyst and photoconductive sensitizer
Polymerization with diborane adducts or oligomers of boron-containing monomers
Polymerizable adhesives containing boron initiators
Stable, aerobically-hardening adhesives containing boron compound initiators
Boron alkyl compounds and processes for their manufacture and use
ApplicationNo. 868368 filed on 05/23/1986
US Classes:526/195, Material contains boron compound other than boron trihalide or non-metal organic complex of boron trihalide526/196, Boron bonded to hydrogen or carbon atom compound526/197, With free oxygen or peroxy compound526/198Contains P, S, or N atom other than as elemental nitrogen
ExaminersPrimary: Schofer, Joseph L.
Assistant: Mulcahy, Peter D.
Attorney, Agent or Firm
International ClassC08C 033/00
Foreign Application Priority Data1985-05-25 DE
AbstractHotmelt adhesives which, after heating, are capable of polymerization under the effect of atmospheric oxygen and which essentially consist of a solid reactive component containing at least one polymerizable ethylenic C=C double bond and a polymerization-initiating organoboron compound and, if desired, other standard auxiliaries.