Patent References 3849242 Conductive structure and method of manufacture thereof Patent #: 4532099 InventorsAssigneeApplicationNo. 041779 filed on 04/23/1987US Classes:442/189, Including strand which is of specific structural definition26/18.5, SHRINKING26/18.6, Thread compacting28/156, By differential shrinkage28/165, Treating28/167, By fluid contact66/202, Materials139/420A, Fabrics wooven of artificial non-cellulosic yarns139/425R, Including metal139/426R, Textile-thread type156/308.2, By tackifying substance of self-sustaining lamina to be bonded; e.g., autogenous bonding, etc.428/922, STATIC ELECTRICITY METAL BLEED-OFF METALLIC STOCK442/286, Woven fabric with a preformed polymeric film or sheet442/287, Ester condensation polymer sheet or film (e.g., polyethylene terephthalate, etc.)442/288, Vinyl polymer or copolymer sheet or film (e.g., polyvinyl chloride, polyvinylidene chloride, polyvinyl acetate, etc.)442/291, Amide condensation polymer sheet or film (e.g., nylon 6, etc.)442/302, Strand is other than glass and is heat or fire resistant442/310Strand material formed of individual filaments having different chemical compositionsExaminersPrimary: Cannon, James C.Attorney, Agent or FirmForeign Patent References
International ClassesB32B 005/04B32B 005/08 D03D 015/04 D06C 029/00 Foreign Application Priority Data1986-04-24 JPAbstractA conductive fabric comprising conductive fibers and thermoplastic fibers with a higher heat shrinkage than that of said conductive fibers, said conductive fibers being crimped by heat shrinkage of said thermoplastic fibers. This invention also provides a conductive sheet or film comprising the conductive fabric and a base on which said conductive fabric is disposed, said conductive fabric and said base that are laminated together being fused into one piece by being heated at a temperature above the melting point of the thermoplastic fibers and melting said thermoplastic fibers. | |