Flat package for integrated circuit devices
Process of making multi-layer ceramic package
Semiconductor arrangement with connector conductors cut out of sheetmetal
Wire bonds and electrical contacts of an integrated circuit device
Support assembly for integrated circuits
High packing density lead frame and integrated circuit
Metal electronic package sealed with thermoplastic having a grafted metal deactivator and antioxidant
Direct current sense lead
Resin packaged semiconductor device having a protective layer made of a metal-organic matter compound
ApplicationNo. 358992 filed on 05/30/1989
US Classes:257/666, LEAD FRAME257/784, Wire contact, lead, or bond257/786, Configuration or pattern of bonds257/787, ENCAPSULATED257/E23.031Lead frames or other flat leads (EPO)
ExaminersPrimary: James, Andrew J.
Assistant: Pemrick, James W.
Attorney, Agent or Firm
International ClassH01L 023/48
AbstractIn an encapsulated semiconductor module in which a semiconductor chip, having a major surface with terminals thereon, is deposed within the encapsulating material, a plurality of self-supporting, unitary, discrete, and continuous lead frame conductors formed of metal sheet stock are positioned at various locations around the chip and cantilevered out of the encapsulating material, so that discrete wires can be used to connect respective ones of said conductors to respective ones of said terminals. In the present invention excessively long bonding wires are avoided by connecting a selected one of said lead frame conductors to a parallel conductor by a jumper wire and connecting the parallel conductor to the desired terminal with a short wire.