U.S. patents available from 1976 to present.
U.S. patent applications available from 2005 to present.

Method of forming a diamond film

Patent 4915977 Issued on April 10, 1990. Estimated Expiration Date: Icon_subject February 25, 2008. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.

Patent References

Film deposition
Patent #: 3961103
Issued on: 06/01/1976
Inventor: Aisenberg

Process for producing diamond-like carbon
Patent #: 4228142
Issued on: 10/14/1980
Inventor: Holcombe, Jr. ,   et al.

Deposition of diamondlike carbon films
Patent #: 4490229
Issued on: 12/25/1984
Inventor: Mirtich ,   et al.

Method for forming a hard carbon thin film on article and applications thereof
Patent #: 4725345
Issued on: 02/16/1988
Inventor: Sakamoto ,   et al.

Method for synthesizing diamond by using plasma Patent #: 4767608
Issued on: 08/30/1988
Inventor: Matsumoto ,   et al.

Inventors

Assignee

Application

No. 160261 filed on 02/25/1988

US Classes:

427/580, Electrical discharge (e.g., arcs, sparks, etc.)204/192.38, Vacuum arc discharge coating423/446Diamond

Examiners

Primary: Silverman, Stanley S.

Attorney, Agent or Firm

Foreign Patent References

  • 60-118693 JP 06/13/1985
  • 60-171294 JP 09/13/1985
  • 1395648 GB 05/13/1975

International Class

B05D 003/06

Foreign Application Priority Data

1987-02-26 JP

Abstract

A method of forming a diamond film on a substrate wherein hydrogen, a hydrocarbon series gas, an inert gas, an organic compound series gas or a mixture of such gases is introduced into a vacuum vessel to contact a substrate and carbon is evaporated by are discharge at a carbon cathode while applying a voltage to the substrate to deposit carbon on the substrate thus forming a diamond film on the substrate. A silicon series gas, a germanium series gas or a mixture thereof may be also introduced into the vessel with the foregoing gas or gases. While the carbon is being deposited on the substrate, thermoelectrons may also be supplied onto the substrate, and, further, high frequency discharge may be generated in a space between the substrate and the cathodes.

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