Lead frame assembly for an integrated circuit molding system
October 6, 2008. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent References 3659821 Die closing unit for injection molding machine with molding die having multiple transfer sections Method and apparatus for encapsulation casting Shuttle plate improvement for a mold for a liquid injection molding apparatus Process for interconnecting components on a PCB Apparatus for encapsulating electronic components RF signal shielding enclosure of electronic systems In-mold process for fabrication of molded plastic printed circuit boards Apparatus for simultaneously encapsulating a plurality of electronic components Patent #: 4752198 InventorsAssigneeApplicationNo. 254333 filed on 10/06/1988US Classes:425/116, Opposed registering coacting female molds174/250, Preformed panel circuit arrangement (e.g., printed circuit)174/251, With encapsulated wire174/255, With particular substrate or support structure249/83, UNITING PREFORM WITH MOLDING MATERIAL264/272.17, Semiconductor or barrier layer device (e.g., integrated circuit, transistor, etc.)425/127, Preform stock acting as reaction shaping surface cooperating with recessed fluent stock shaping means425/129.1, Means to charge fuent stock under pressure425/190, For extrusion or injection type shaping means425/258, Means to move feed means to female mold425/544Means for transfer moldingExaminersPrimary: Chiesa, Richard L.Attorney, Agent or FirmInternational ClassB29C 045/14AbstractA lead frame assembly is disclosed which interfaces with existing wire bonders using a single track design from the bonder through the molding process. During the molding operation, the bonded lead frame is transferred into the mold on a guide track system built into the mold chase. The mold closes and clamps the lead frame after which a compound charging system meters and injects a compound into the mold cavities. The mold is opened and the strip ejected and transferred out of the mold via internal guide tracks. A granular or pellet form of compound is used in the charging system. The lead frame assembly has side rails, between which a temporary and a permanent support structure is formed. The temporary support structure is removed from the bonded integrated circuits after the bonding process is completed, while the permanent structure is made a part of the bonded integrated circuit package. A portion of the temporary support structure has a hole through it, which allows the bonding compound to pass through the lead frame to enable encapsulation of the integrated circuit both above and below the lead frame in the bonding cavity.Field of SearchOpposed registering coacting female moldsFemale mold type means Means to convey preform to female mold Preform stock acting as reaction shaping surface cooperating with recessed fluent stock shaping means Means to charge fuent stock under pressure Means to move feed means to female mold Means for transfer molding For extrusion or injection type shaping means Semiconductor or barrier layer device (e.g., integrated circuit, transistor, etc.) UNITING PREFORM WITH MOLDING MATERIAL Having plural mold sections With means to move section Preformed panel circuit arrangement (e.g., printed circuit) With encapsulated wire With particular substrate or support structure | |
