Semiconductor wafer array
Patent 4897708 Issued on January 30, 1990. Estimated Expiration Date: 
January 30, 2007. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.
January 30, 2007. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent References 2627545 2734154 3475660 3648131 3769702 3813773 3867759 Electrostatic switch High-power semiconductive devices Electrical package for LSI devices and assembly process therefor InventorAssigneeApplicationNo. 887129 filed on 07/17/1986US Classes:257/690, With contact or lead257/773, Of specified configuration257/E23.01, Arrangements for conducting electric current to or from solid-state body in operation, e.g., leads, terminal arrangements (EPO)257/E23.011, Internal lead connections, e.g., via connections, feedthrough structures (EPO)257/E25.013Stacked arrangements of devices (EPO)ExaminersPrimary: Tarcza, Thomas H.Assistant: Sotomayor, John B. Attorney, Agent or FirmInternational ClassesH01L 023/48H01L 023/52 AbstractA wafer array comprising a plurality of wafers of semiconductor material are stacked one on top of another. Through holes are provided in the wafers and electrically conductive liquid is inserted in the through holes for interconnecting all of the wafers. The conductive liquid is electrically insulated from all parts of the wafers except a part comprising an electrically conductive bonding pad which provides an electrical path between the conductive liquid and transistors located in the wafers. The wafers, which are disposed in a stack one on top of the other, are mounted in an enclosure and coupled to electrical pin members for connection to external devices. | |
