U.S. patents available from 1976 to present.
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Thermoplastic molding compositions based on polycarbonates, polyesters and polyamides

Patent 4879324 Issued on November 7, 1989. Estimated Expiration Date: Icon_subject February 16, 2009. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.

Patent References

3714722

Flame retarded polyester molding composition with improved electrical performance Patent #: 4636544
Issued on: 01/13/1987
Inventor: Hepp

Inventors

Assignee

Application

No. 311392 filed on 02/16/1989

US Classes:

523/400, Process of forming a composition containing a nonreactive material (NRM) and a polymer containing more than one 1,2-epoxy group, or a preformed polymer derived from or admixed with a reactant containing more than one 1,2-epoxy group, or with a polymer derived from an epihalohydrin and a polyhydric phenol or polyol; or composition or product thereof523/436, Polymer is graft, graft-type, block, or block-type523/466, Inorganic SI-O bond DNRM525/66, With solid polymer derived from at least one nitrogen-containing reactant wherein at least one of the reactants forming the solid polymer is saturated; or with SPFI wherein at least one of the necessary ingredients contains a nitrogen atom or with a reaction product thereof; or with nitrogen-containing SICP525/67, With solid polymer derived from at least one hal-C(=O)-hal, O-C(=O)-O or hal-C(=O)-O- reactant wherein at least one of the reactants forming the solid polymer is saturated; or with SPFI wherein at least one of the necessary ingredients is a hal-C(=O)-hal, O-C(=O)-O, or hal-C(=O)-O containing reactant or reaction product thereof; or with a SICP containing a hal-C(=O)- or O-C(=O)-O- group525/109, With phenolic reactant or polymer thereof and is free of 1,2-epoxy groups525/133, Contacting two or more solid polymers with a phenolic reactant; or contacting a solid polymer with a phenolic reactant and subsequently contacting the treated polymer with an additional solid polymer525/166, Two or more solid polymers present other than derived from a polycarboxylic acid or derivative and a polyol525/423, Mixed with reactant containing more than one 1,2-epoxy group per mole or polymer derived therefrom525/425Mixed with polycarboxylic acid or derivative and polyhydroxy reactant or polymer therefrom

Examiners

Primary: Bleutge, John C.
Assistant: Buttner, David

Attorney, Agent or Firm

Foreign Patent References

  • 0025920 EP. 04/18/1981
  • 0114288 EP. 08/18/1984
  • 0044141 EP. 04/18/1985
  • 2751969 DE. 06/18/1978
  • 7120628 JP 06/18/1971
  • 113049 JP 06/18/1984
  • 1450321 GB. 09/18/1976
  • 1475562 GB. 06/18/1977
  • 1496018 GB. 12/18/1977
  • WO8000972 WO. 05/18/1980

International Classes

C08L 077/00
C08L 067/00
C08L 063/00

Foreign Application Priority Data

1986-11-29 DE

Abstract

Thermoplastic molding compositions contain as essential components(A) from 1 to 90% by weight of a polycarbonate,(B) from 1 to 90% by weight of a polyester,(C) from 1 to 90% by weight of a polyamide,(D) from 0.5 to 30% by weight of a polymeric component having hydroxyl groups and in addition(E) from 0 to 30% by weight of an impact-modifying rubber and(F) from 0 to 60% by weight of a fibrous or particulate filler.

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