Lead- and antimony-free solder composition
Patent 4879096 Issued on November 7, 1989. Estimated Expiration Date: 
April 19, 2009. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.
April 19, 2009. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent References 1437641 3607253 Solder composition Solder composition Pb-free, tin base solder composition Low toxicity corrosion resistant solder Tin base lead-free solder composition containing bismuth, silver and antimony Patent #: 4806309 InventorAssigneeApplicationNo. 340370 filed on 04/19/1989US Classes:420/561, Antimony, or bismuth containing228/262.61Brazing or solderingExaminersPrimary: McDowell, Robert L.Attorney, Agent or FirmForeign Patent References
International ClassC22C 013/00AbstractLead-free and antimony-free solder compositions are described which comprise, as essential ingredients, about 0.05% to about 3% by weight of silver; about 0.5% to about 6% by weight of copper; about 0.1% to about 3% by weight of bismuth; and about 88% to about 99.35% by weight of tin. In preferred embodiments, the solders are also essentially free of cadmium and may also be essentially free of both cadmium and zinc.Field of SearchAntimony, or bismuth containing | |
