Firing process for forming a multilayer glass-metal module
Multilayered glass-ceramic substrate for mounting of semiconductor device
Electronic package assembly method
Multichip thin film module
Implantable pulse generator having a single printed circuit board and a chip carrier
Multiple voltage integrated circuit packaging substrate
Multilayer wiring substrate
ApplicationNo. 259319 filed on 10/18/1988
US Classes:438/125, Insulative housing or support29/830, Assembling bases29/847, With selective destruction of conductive paths257/E21.511, Mounting on insulating member provided with metallic leads, e.g., flip-chip mounting, conductive die mounting (EPO)257/E23.173, Multilayer substrates (EPO)361/784, Plural438/623Including organic insulating material between metal levels
ExaminersPrimary: Hearn, Brian E.
Assistant: Pawlikowski, Beverly A.
Attorney, Agent or Firm
Foreign Patent References
International ClassH01L 021/60
Foreign Application Priority Data1985-11-11 JP
AbstractA method for manufacturing a multichip package including the steps of forming a first polyimide insulating layer on a surface of a ceramic multilayer substrate having a circuit wiring therein, forming a first wiring connected to the circuit wiring of the multilayer substrate with a part of the first wiring being exposed at an open surface of the first polyimide insulating layer, forming a second polyimide insulating layer on a surface of a semiconductor element, and forming a second wiring connected with a circuit wiring of the semiconductor element in the second polyimide insulating layer with a part of the second wiring being exposed at an open surface of the second polyimide insulating layer. The method also includes positioning the semiconductor element on the substrate such that the part of the first wiring and the part of the second wiring oppose each other, and applying a predetermined pressure and a predetermined temperature in a predetermined gas atmosphere for a predetermined time period to cause the first and second polyimide layers to be cured and bonded with each other and to cause the parts of first and second wirings to be adhered to each other by thermal bonding.