Diamond compacts and process for making same
October 17, 2006. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent References 3574580 Polycrystalline diamond body Compact-grained diamond material Silicon carbide and silicon bonded polycrystalline diamond body and method of making it Process for preparing a polycrystalline diamond body Process for preparing a silicon-bonded polycrystalline diamond body Polycrystalline diamond body and process Polycrystalline diamond body/silicon carbide substrate composite Method of making diamond compacts for rock drilling Patent #: 4259090 InventorApplicationNo. 882937 filed on 06/19/1986US Classes:51/293, MISCELLANEOUS51/307, WITH INORGANIC MATERIAL51/308, Clay, silica, or silicate51/309Metal or metal oxideExaminersPrimary: Lieberman, PaulAssistant: Thompson, Willie J. Attorney, Agent or FirmInternational ClassB24D 003/00Foreign Application Priority Data1984-08-24 AUAbstractA process for producing a diamond compact having a compressive strength of at least 10 kbars, the process being performed in the graphite stability field at a maximum pressure of 40 kbars at a temperature of between 1100° C. and 1600° C. for a time which permits plastic deformation of the diamond crystals giving face-to-face contacts there-between and a substantial or complete degree of chemical equilibration between the bonding agent and the diamond crystals. Bonding agents are selected from elements and alloys which produce a bond with diamond having a melting point above 1600° C. and which inhibit the formation of free graphite in the compact. | |
