Method for roughening ceramic substrate surface and method for manufacturing printed circuit board using surface-roughened ceramic substrate
October 27, 2007. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent References 3296012 Method of making a glass containing resistor having a sub-micron metal film termination Thick film resistor circuits Method for selective electroless plating of copper onto a non-conductive substrate surface Electroless copper plating solution Metallization of ceramics Electrically conductive ferrofluid compositions and method of preparing and using same Process for avoiding blister formation in electroless metallization of ceramic substrates Phosphate recovery from wet phosphoric acid purification process Hybrid and multi-layer circuitry Patent #: 4696851 InventorsAssigneeApplicationNo. 07/113125 filed on 10/27/1987US Classes:427/96.9, Front and back of substrate coated (excluding processes where all coating is by immersion)427/305, Nickel, copper, cobalt, or chromium coating427/443.1, Chemical compound reducing agent utilized (i.e., electroless deposition)427/97.2, Coating hole wall427/99.5Immersion metal plating from solution (e.g., electroless plating, etc.)ExaminersPrimary: Beck, ShriveAssistant: Dang, Vi Duong Attorney, Agent or FirmInternational ClassesC04B 41/53 (20060101)C04B 41/91 (20060101) C23C 18/18 (20060101) H05K 3/38 (20060101) H05K 3/18 (20060101) H05K 1/03 (20060101) Foreign Application Priority Data1986-11-08 JPAbstractA method for roughening a ceramic substrate surface includes a step of sequentially taking out part of roughening a treatment bath of phosphoric acid into which the ceramic substrate is dipped prior to a formation on the substrate of conductor a layer, and subjecting the part of the bath taken out sequentially to regeneration treatment. Any increase in the viscosity due to dehydrating condensation of the roughening bath can be thereby effectively restrained to prolong effective life of the bath. Further, the surface roughened ceramic substrate can be provided thereon with conductor layers smoothly formed by means of a plating and eventually with a circuit pattern as well as a resistor formed on the pattern within an inert gas atmosphere.Other References
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