Patent ReferencesInventorApplicationNo. 07/258752 filed on 10/17/1988US Classes:228/116, With pretreating of work228/121, Bonding nonmetals with metallic filler228/124.1With treatingExaminersPrimary: Ramsey, Kenneth J.Attorney, Agent or FirmInternational ClassesB23K 20/16 (20060101)B23K 35/00 (20060101) B23K 35/26 (20060101) AbstractA method of bonding molybdenum and zinc sulfide devices (10, 12) together comprising the steps of lapping the surface of the nickel layers to about a 20,000 Angstrom smoothness, placing nickel layers (16, 16') of about 700 Angstroms respectively on the devices, plating layers of gold (18, 18') of about 4 microns thickness respectively on the nickel layers, respectively immersing the gold-plated layers in a bath (20) of mercury, inverting one (10) of the devices above the other (12), bringing the devices together to effect contact between the mercury films (22, 22'), pressing the devices together within a pressure range of 2 kilograms per square inch to 20 kilograms per square inch for a minimum of 16 hours at room temperature, and sealing the periphery of the gold-mercury seal contact with a nickel seal (26). | |