Apparatus for measuring an adhesion force of a thin film
Patent 4856326 Issued on August 15, 1989. Estimated Expiration Date: 
July 26, 2008. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.
July 26, 2008. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent ReferencesMethod for nondestructive testing of coating adhesion Patent #: 4606225 InventorApplicationNo. 07/224306 filed on 07/26/1988US Classes:73/150A, Bond strength73/799, Specimen cracking or crack propagation73/801Acoustic emissionExaminersPrimary: Myracle, Jerry W.Attorney, Agent or FirmInternational ClassesG01N 19/04 (20060101)G01N 19/00 (20060101) G01N 3/00 (20060101) G01N 3/06 (20060101) Foreign Application Priority Data1987-07-27 JPAbstractAn apparatus for measuring the adhesion force of a thin film deposited on a substrate of a specimen. The apparatus comprises an inclining mechanism for mounting a sample dish with a specimen inclined by a predetermined angle with respect to the sample dish, an indentor disposed above the specimen for deforming the specimen by indentation, a driver for driving the indentor perpendicular to the sample dish, a load transducer for measuring a load applied to the specimen by the indentor, a sensor for sensing propagation of a crack produced in the specimen by the load, a displacement gage interlocked with the driver for measuring a penetration depth of the indentor, and a measuring mechanism for measuring the adhesion force of the thin film to the substrate.Other References
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