Method of using heat-recoverable articles comprising conductive polymer compositions

Patent 4853165 Issued on August 1, 1989. Estimated Expiration Date:

June 26, 2007. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.

Abstract Claims Description Full Text

Patent References

3540757

3658976

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Inventors

Assignee

Raychem Corporation

Application

No. 07/067679 filed on 06/26/1987

US Classes:

264/450, Organic material contains specified conductive enhancing component (e.g., filler, etc.)156/86, Of lamina covering cylindrical or spherical body219/535, Specially formed or adapted to fit material to be heated (e.g., a pipe)264/104, FORMING ELECTRICAL ARTICLES BY SHAPING ELECTROCONDUCTIVE MATERIAL264/105, Conductive carbon containing264/230, UTILIZING HEAT RELEASABLE STRESS TO RESHAPE SOLID WORKPIECE (E.G., ELASTIC MEMORY, ETC.)264/342R, To shrink264/36.16, Pipes or tubes264/494Polymerizing, cross-linking, or curing (e.g., utilizing ultraviolet radiation, etc.)

Examiners

Primary: Thurlow, Jeffery

Attorney, Agent or Firm

International Classes

B29C 61/00 (20060101)
B29C 65/00 (20060101)
B29C 61/06 (20060101)
B29C 65/68 (20060101)
F16L 55/16 (20060101)
F16L 55/17 (20060101)
F16L 47/00 (20060101)
F16L 47/22 (20060101)

Abstract

Methods of modifying substrates, in particular joining pipes, especially pipes composed of glass fiber-reinforced polymers, make use of heat-recoverable conductive polymer articles. An insert is placed between the substrate and the article, and undergoes a desired chemical and/or physical change when the article is recovered. Preferably the insert is a fiber-reinforced thermosetting polymer which is cured in situ against the substrate. Preferably the conductive polymer is a sintered material or another material having good physical properties above its recovery temperature.