Liquid cooled high density packaging for high speed circuits
July 5, 2008. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent References 3739232 3741292 Liquid encapsulated integrated circuit package Semiconductor package with improved conduction cooling structure Package for mounting and interconnecting a plurality of large scale integrated semiconductor devices Heat-pipe cooled electronic circuit card Apparatus for cooling high-density integrated circuit packages Apparatus for cooling integrated circuit chips Cooling system for VLSI circuit chips Immersion cooled high density electronic assembly InventorApplicationNo. 07/214991 filed on 07/05/1988US Classes:361/700, Change of physical state165/104.26, Utilizing capillary attraction165/907, POROUS257/713, For integrated circuit257/715, Boiling (evaporative) liquid257/E23.088, Cooling by change of state, e.g., use of heat pipes (EPO)361/701, With heat exchanger unit361/762With specific dielectric material or layerExaminersPrimary: Tolin, Gerald P.Attorney, Agent or FirmInternational ClassesH05K 7/20 (20060101)H01L 23/34 (20060101) H01L 23/427 (20060101) AbstractHigh power dissipating micro electronic circuit chips are cooled in a high ensity package by mounting individual chips on sintered stainless steel pads and surrounding the micro chips with a liquid fluoro-chemical to achieve cooling. The chips are directly bonded to the sintered stainless steel pads and are not packaged in chip carriers. The stainless steel pads provide a solid mounting for the chips to allow for wire bonding of the chips directly to the printed circuit board and electrical interconnections accommodate the differential coefficient of expansion between the chips and the housing. The stainless steel pads acts as wicks drawing the coolant fluid to the bottom side of the chips while the top side of the chips, also in direct contact with the coolant, enable the fluid to boil and remove heat during liquid to vapor transformation, thereby limiting the surface temperature of the chips to the boiling point of the coolant.Field of SearchAir cooled, including fins | |
