Method for treating a polyimide surface to improve the adhesion of metal deposited thereon, and articles produced thereby
Patent 4842946 Issued on June 27, 1989. Estimated Expiration Date: 
September 28, 2007. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.
September 28, 2007. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent ReferencesSensitized polyimides and circuit elements thereof Adhesive metallization of polyimide Metallization of electrically insulating polyimide/aromatic polyamide film substrates Patent #: 4565606 InventorsApplicationNo. 07/103618 filed on 09/28/1987US Classes:428/458, Next to polyester, polyamide or polyimide (e.g., alkyd, glue, or nylon, etc.)205/164, Synthetic resin substrate205/210, Treating substrate with liquid other than tap water (e.g., for removing foreign material, etching, activating, etc.)205/224, Heating205/291, Copper205/926, Polyamide or polyimide (e.g., nylon, etc.)427/304, Metal coating (e.g., electroless deposition, etc.)427/306, Organic base427/307, Etching, swelling, or dissolving out part of the base428/474.4Of polyamideExaminersPrimary: Niebling, John F.Assistant: Leader, William T. Attorney, Agent or FirmInternational ClassesC23C 18/20 (20060101)H05K 3/38 (20060101) C23C 18/26 (20060101) AbstractA method for treating a polyimide surface is disclosed, in which an adhesion-promoting compound such as thiourea contacts the surface prior to the electroless plating of metal thereon. Articles formed by such a method are also disclosed.Other References
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