Tin base lead-free solder composition containing bismuth, silver and antimony
Patent 4806309 Issued on February 21, 1989. Estimated Expiration Date: 
January 5, 2008. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.
January 5, 2008. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent References 3607253 Solder composition Patent #: 4670217 InventorAssigneeApplicationNo. 07/141057 filed on 01/05/1988US Classes:420/562, Antimony, or bismuth containing420/561Antimony, or bismuth containingExaminersPrimary: Rutledge, L. DewayneAssistant: McDowell, Robert L. Attorney, Agent or FirmInternational ClassesB23K 35/26 (20060101)C22C 13/00 (20060101) C22C 13/02 (20060101) AbstractA lead-free solder composition of approximately 90% to 95% by weight tin, approximately 3% to 5% by weight antimony, approximately 1% to 4.5% by weight bismuth, and approximately 0.1% to 0.5% by weight silver. | |
