U.S. patents available from 1976 to present.
U.S. patent applications available from 2005 to present.

Stacked static random access memory cell having capacitor

Patent 4805147 Issued on February 14, 1989. Estimated Expiration Date: Icon_subject June 9, 2006. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.

Patent References

Field-effect transistor structure in multilevel polycrystalline silicon
Patent #: 4240097
Issued on: 12/16/1980
Inventor: Raymond, Jr.

Semiconductor memory device
Patent #: 4532609
Issued on: 07/30/1985
Inventor: Iizuka

Bipolar memory cell
Patent #: 4543595
Issued on: 09/24/1985
Inventor: Vora

MOS static ram with capacitively loaded gates to prevent alpha soft errors
Patent #: 4590508
Issued on: 05/20/1986
Inventor: Hirakawa ,   et al.

Dynamic memory device with an RC circuit for inhibiting the effects of alpha particle radiation Patent #: 4641165
Issued on: 02/03/1987
Inventor: Iizuka ,   et al.

Inventors

Assignee

Application

No. 06/871994 filed on 06/09/1986

US Classes:

365/154, Flip-flop (electrical)257/297, With means for preventing charge leakage due to minority carrier generation (e.g., alpha generated soft error protection or "dark current" leakage protection)257/904, WITH PASSIVE COMPONENTS, (e.g., POLYSILICON RESISTORS)257/906, DRAM WITH CAPACITOR ELECTRODES USED FOR ACCESSING (E.G., BIT LINE IS CAPACITOR PLATE)257/E27.098, Static random access memory, SRAM, structure (EPO)257/E27.101, Load element being a resistor (EPO)365/182Insulated gate devices

Examiners

Primary: Hecker, Stuart N.
Assistant: Bowler, Alyssa H.

Attorney, Agent or Firm

International Classes

G11C 11/412 (20060101)
H01L 27/11 (20060101)

Foreign Application Priority Data

1985-06-10 JP

Abstract

A static random access memory cell in which capacitors are electrically connected to storage nodes, so that the memory cell will not suffer from soft error even when it is hit by alpha particles. The memory cell has MOS transistors, capacitors constituted by two polycrystalline silicon layers, and resistors constituted by a polycrystalline silicon layer, that are formed on a semiconductor substrate.

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