Soft-solder alloy for bonding ceramic articles
Patent 4797328 Issued on January 10, 1989. Estimated Expiration Date: 
February 17, 2007. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.
February 17, 2007. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent References 2805944 3484210 InventorsAssigneeApplicationNo. 07/015259 filed on 02/17/1987US Classes:428/621, With additional, spatially distinct nonmetal component228/121, Bonding nonmetals with metallic filler228/122.1, Metal to nonmetal with separate metallic filler228/262.61, Brazing or soldering420/557, TIN BASE420/563, LEAD BASE420/566, Silver containing428/457, Of metal428/645, Pb-base component428/646Sn-base componentExaminersPrimary: Sheehan, John P.Assistant: McDowell, Robert L. Attorney, Agent or FirmInternational ClassesB23K 35/26 (20060101)C04B 37/02 (20060101) C04B 37/00 (20060101) Foreign Application Priority Data1986-02-19 DEAbstractSoft-solder alloys for connecting ceramic parts without permetallization comprising 86 to 99% lead or tin, 0 to 13% silver and/or copper, 0 to 10% indium and 1 to 10% titanium and/or zirconium. | |
