U.S. patents available from 1976 to present.
U.S. patent applications available from 2005 to present.

Apparatus for loading and unloading a vacuum processing chamber

Patent 4797054 Issued on January 10, 1989. Estimated Expiration Date: Icon_subject June 13, 2006. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.

Patent References

3641973

3656454

3874525

3915117

Vapor deposition apparatus
Patent #: 4226208
Issued on: 10/07/1980
Inventor: Nishida ,   et al.

Device for cryogenically fabricating source material for plasma X-ray lasers
Patent #: 4508055
Issued on: 04/02/1985
Inventor: Elton ,   et al.

Wafer holding apparatus for ion implantation
Patent #: 4553069
Issued on: 11/12/1985
Inventor: Purser

Vacuum load lock apparatus Patent #: 4632624
Issued on: 12/30/1986
Inventor: Mirkovich ,   et al.

Inventor

Application

No. 06/874000 filed on 06/13/1986

US Classes:

414/217, APPARATUS FOR MOVING MATERIAL BETWEEN ZONES HAVING DIFFERENT PRESSURES AND INHIBITING CHANGE IN PRESSURE GRADIENT THEREBETWEEN414/939Including wafer charging or discharging means for vacuum chamber

Examiners

Primary: Aschenbrenner, Peter A.
Assistant: Brittain, James R.

Attorney, Agent or Firm

International Class

H01L 21/00 (20060101)

Foreign Application Priority Data

1985-06-17 JP

Abstract

A main chamber is provided through which a workpiece is loaded or unloaded. A second chamber is provided within the main chamber to cover the workpiece during evacuation and gas introduction processes performed within the main chamber. The second chamber protects the workpiece from floating dust deposited on parts within the main chamber and blown about by a turbulent flow of introduced or evacuated gas therein. The second chamber can be shaped like a bell jar and is made as small as possible. A driving circuit lifts the bell jar up and down. The gas pressure within the second chamber is maintained greater than or equal to that of the main chamber by a pressure control circuit to prevent dust intrusion into the second chamber. A slow leak circuit is provided as a pressure control device by forming a loose vacuum-seal between the second chamber and the main chamber. A gas introduction circuit and/or evacuation circuit may be connected to the second chamber. A workpiece transfer device is located at the outside of the second chamber. The second chamber may be part of a vacuum processing chamber, thereby allowing the workpiece to be directly loaded into and unloaded from the processing chamber.

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