U.S. patents available from 1976 to present.
U.S. patent applications available from 2005 to present.

Thin film magnetic read-write head/arm assemblies

Patent 4789914 Issued on December 6, 1988. Estimated Expiration Date: Icon_subject October 28, 2006. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.

Patent References

3564522

Read/write thin film head Patent #: 4219853
Issued on: 08/26/1980
Inventor: Albert ,   et al.

Inventors

Application

No. 06/923942 filed on 10/28/1986

US Classes:

360/234.5, Electrical attachment of slider/head360/234.4, IC/circuit component on slider360/246Noise reduction

Examiners

Primary: Heinz, A. J.

Attorney, Agent or Firm

International Classes

G11B 5/31 (20060101)
G11B 5/48 (20060101)

Abstract

A thin film magnetic read/write head/arm assembly and method of manufacturing the same is disclosed herein. Contact soldering of the opposite to disk side of the read/write head to a cable in laminate relationship to the suspension arm, or a polyimide strip with conductors deposited thereon provides both electrical interconnection and mechanical support. Semiconductor devices can also be intermediately soldered between the head and cable for maximum noise suppression.

Other References

  • Warwick, "Multilayer Ceramic Slider for Thin Film Heads", IBM Technical Disclosure Bulletin, vol. 15, No. 7, 2/72-pp. 2183-2184
  • Reidenbach, "Combination Suspension-Lead Cable for a Multi-Gap Read/Write Head", IBM Technical Disclosure Bulletin, vol. 22, No. 4, 9/79, pp. 1602-1603
  • Church et al, "Method for Wiring a Magnetic Head", IBM Technical Disclosure Bulletin, vol. 23, No. 8, 1/81, pp. 3873-3874
  • Chase et al, "Semiconductor Solder Reflow Chip Substrate Joinint," IBM Tech. Discl. Bulletin, vol. 16, No. 8, 1/74, p. 2675
  • Watrous, "Magnetic Head Suspension Assembly", IBM Tech. Discl. Bulletin, vol. 24, No. 10, 3/82, p. 4915
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