Solid-state imaging device
Microcircuit package and sealing method
Image sensor assembly
Solid-state imaging device assembly
Endoscope having a plate-like image sensor for forming images
Endoscope having internal pressure communication means Patent #: 4706654
ApplicationNo. 07/083401 filed on 08/10/1987
US Classes:348/76, Physical structure of circuit element257/784, Wire contact, lead, or bond600/109, With camera or solid state imager600/130With particular arrangement of internal elements (e.g., shaft reducing)
ExaminersPrimary: Groody, James J.
Assistant: Peng, John K.
Attorney, Agent or Firm
International ClassesH04N 5/225 (20060101)
A61B 1/05 (20060101)
A61B 1/04 (20060101)
Foreign Application Priority Data1986-09-04 JP
AbstractAn electronic endoscope, equipped with an imaging apparatus having side bonding pads, is provided with a flexible insertable part which is formed to be small in diameter. Within a tip of the insertable part, a solid state imaging device is formed and a solid state imaging chip is provided with chip side bonding pads. The solid state imaging chip is secured to a base provided with base side bonding pads in groups. The chip side bonding pads and base side bonding pads are connected respectively with each other through bonding wires. The chip side bonding pads are provided on one side of the image area in a plurality of rows.