U.S. patents available from 1976 to present.
U.S. patent applications available from 2005 to present.

Process for producing color filter using alignment marks

Patent 4777117 Issued on October 11, 1988. Estimated Expiration Date: Icon_subject October 30, 2006. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.

Patent References

System for providing photomask alignment keys in semiconductor integrated circuit processing
Patent #: 4343878
Issued on: 08/10/1982
Inventor: Chiang

Method of manufacturing a semiconductor device
Patent #: 4423127
Issued on: 12/27/1983
Inventor: Fujimura

Process for preparing a color proofing sheet
Patent #: 4482625
Issued on: 11/13/1984
Inventor: Namiki ,   et al.

Sequential automatic registration and imagewise exposure of a sheet substrate
Patent #: 4522903
Issued on: 06/11/1985
Inventor: Heiart ,   et al.

Process and composition for producing permanently water wettable surfaces
Patent #: 4536420
Issued on: 08/20/1985
Inventor: Rickert, Jr.

Photoresist lift-off process for fabricating semiconductor devices Patent #: 4564584
Issued on: 01/14/1986
Inventor: Fredericks ,   et al.

Inventors

Assignee

Application

No. 06/924737 filed on 10/30/1986

US Classes:

430/293, Color proofing or multicolor image formation430/22, REGISTRATION OR LAYOUT PROCESS OTHER THAN COLOR PROOFING430/7Color

Examiners

Primary: Brammer, Jack P.

Attorney, Agent or Firm

International Classes

G03F 7/00 (20060101)
G03F 9/00 (20060101)

Foreign Application Priority Data

1985-11-06 JP

Abstract

A process for producing a color filter having plural number of colorant layer patterns by repeating, for each of a plural number of starting materials for colorant layer, the steps of subjecting a substrate having a photoresist laminated thereon to pattern exposure to effect patterning of said photo-resist, laminating a colorant layer from said photoresist above and removing the layer of said photoresist having said colorant layer laminated thereon by dissolution to form a colorant layer pattern, comprises forming an alignment mark on said substrate with the same starting material as a first colorant layer pattern simultaneously with formation of said first colorant layer pattern and performing registration of the mask during formation of a second colorant layer pattern et seq. through said alignment mark.

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