Pattern inspection method
April 11, 2006. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent ReferencesCharacter pattern line thickness regularizing device Image comparison systems Method of detecting pattern defect and its apparatus Apparatus for inspecting mask used for manufacturing integrated circuits Pattern checking apparatus High speed optical inspection system Pattern recognition apparatus and a pattern recognition method Misregistration/distortion correction scheme Patent #: 4668982 InventorsAssigneeApplicationNo. 06/850681 filed on 04/11/1986US Classes:382/147, Inspecting printed circuit boards382/220Calculating weighted similarity or difference (e.g., don`t-care areas)ExaminersPrimary: Boudreau, Leo H.Attorney, Agent or FirmInternational ClassesG06T 7/00 (20060101)G01N 21/956 (20060101) G01N 21/88 (20060101) Foreign Application Priority Data1985-04-12 JPAbstractTwo kinds of image corresponding to a reference pattern and a pattern to be inspected are converted into binary images and local images cut out from the binary images are compared with each other to detect differences between the cut out images and recognize these differences as a defect. One of the main subjects of the inspecting method is to moderate excess sensitivity to the different portions to the extent of allowing non-serious actual defects. By setting don't care areas each of which consists of one pixel row neighboring on a binary boundary line in the image, and comparing the remaining portions of the images other than the don't care areas by logical processing it is possible to detect various defects without regarding the quantization error as a defect.Other References
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